Mastering complexity in every PCB
Graphic’s IPC-trained Application Engineers support your product from design through to volume production, specialising in impedance control, DFM, cost reduction, material selection and panelisation. Working across Sales and Engineering, they ensure a seamless link between design and manufacture to deliver efficient, reliable PCB solutions.
For compact and high-performance applications.
Combining Flexibility and rigidity for complex designs.
Up to 32 layers for intricate circuitry.
Blind / buried vias, copper-filled micro-vias, resin filled vias and stacked vias.
Integrated copper coin for optimal thermal performance.
Advanced embedding techniques for enhanced functionality.
RF & Digital PCBs.
Our purpose-built High-Density Interconnect (HDI) plant is equipped with the latest technology to meet the most demanding requirements. We offer a comprehensive range of PCB technologies, ensuring the highest performance and reliability for your applications and placing us at the forefront of PCB technology.
Our expertise extends to working with a variety of high performance materials to suit diverse application needs. We specialise in the following:
Graphic offers a variety of surface finishes, providing diverse options for reliability, corrosion resistance, and solderability.
