Technology

Leaders in innovation with high-mix low/med-volume.

Solder Resist Imaging Analysis
Capability

Cutting-Edge PCB Technology

Our purpose-built High-Density Interconnect (HDI) plant is equipped with the latest technology to meet the most demanding requirements. We offer a comprehensive range of PCB technologies, ensuring the highest performance and reliability for your applications. Graphic is at the forefront of PCB technology:

  • HDI Technology: For compact and high-performance
    applications.
  • Flex-Rigid PCBs: Combining flexibility and rigidity for
    complex designs.
  • Multilayer Rigid PCBs: Up to 32 layers for intricate circuitry.
  • Advanced Via Technologies: Including blind/buried vias,
    copper-filled micro-vias, resin-filled vias, and stacked vias.
  • Thermal Management Solutions: Integrated copper coin for optimal thermal performance.
  • Embedded Technologies: Advanced embedding techniques
    for enhanced functionality.

Advanced Materials

Our expertise extends to working with a variety of high- performance materials to suit diverse application needs. We specialise in:

  • FR4 – High Tg

High thermal performance, suitable for demanding applications.

  • Polyimide, BT, Cyanate Ester (Glass Reinforced)

Superior thermal stability and mechanical strength.

  • PTFE (Various Types)

Excellent electrical properties for high-frequency uses.

  • High Speed / Low Loss Materials

Minimise signal loss in high-frequency circuits.

  • Polyimide Film (Flexible Material)

Adhesiveless: High reliability and flexibility.

With Adhesive: Strong bonding for multilayer PCBs.

  • Advanced Substrates
  • Copper-Invar-Copper: Low thermal expansion.
Surface Preparation

Surface Finishes

Graphic offers a variety of PCB surface finishes:

  • Electroless Nickel/Immersion Gold (ENIG)
  • Hot Air Solder Level (HASL)
  • SnPb (non-RoHS compliant)
  • Electroless Nickel/Electroless Palladium/Immersion
    Gold
  • OSP (Lead-free, subcontracted)
  • Hard Gold (Edge connectors)
  • Soft Gold (subcontracted)
  • All-over Gold (non-preferred, subcontracted)
  • Unfused/Fused Tin-Lead (subcontracted)
  • Immersion Tin/Silver (subcontracted)

These finishes provide diverse options for reliability, corrosion resistance, and solderability.