Technology

Mastering complexity in every PCB build

Design for Manufacturing

Graphic’s IPC-trained Application Engineers support your product from design through to volume production, specialising in impedance control, DFM, cost reduction, material selection and panelisation. Working across Sales and Engineering, they ensure a seamless link between design and manufacture to deliver efficient, reliable PCB solutions.

Cutting-Edge PCB Technology

Our purpose-built High-Density Interconnect (HDI) plant is equipped with the latest technology to meet the most demanding requirements. We offer a comprehensive range of PCB technologies, ensuring the highest performance and reliability for your applications. Graphic is at the forefront of PCB technology:

HDI Technology: For compact and high-performance
applications.
Flex-Rigid PCBs: Combining flexibility and rigidity for
complex designs.
Multilayer Rigid PCBs: Up to 32 layers for intricate circuitry.
Advanced Via Technologies: Including blind/buried vias,
copper-filled micro-vias, resin-filled vias, and stacked vias.
Thermal Management Solutions: Integrated copper coin for optimal thermal performance.
Embedded Technologies: Advanced embedding techniques
for enhanced functionality.
RF and Digital PCBs

Advanced Materials

Our expertise extends to working with a variety of high performance materials to suit diverse application needs. We specialise in:

FR4 – High Tg – High thermal performance, suitable for demanding applications.
Polyimide, BT, Cyanate Ester (Glass Reinforced) – Superior thermal stability and mechanical strength.
PTFE (Various Types) – Excellent electrical properties for high-frequency uses.
High Speed / Low Loss Materials – Minimise signal loss in high-frequency circuits.
Polyimide Film (Flexible Material) – Adhesiveless: High reliability and flexibility. With Adhesive: Strong bonding for multilayer PCBs.
Advanced Substrates
Copper-Invar-Copper: Low thermal expansion.